Wafer Pre Aligner - WA Series
High speed type / non-contact type / built-in controller / compact design / one-chuck system / various sizes supported (up to 12 inches / 300 mm), corresponding to chipping inspection
Product Features
- It supports various sizes of wafers (up to 12 inches / 300 mm) .
- It is a “one-chuck” system that leaves only one chuck mark.
- We are ready to meet various customer demands for the exterior colors / materials.
- Chuck materials are available in PEEK (black).
- It also corresponds to chipping inspection (8-inch type only / additional specification).
- It’s a high speed type device processing time of 5 seconds.
Product specification
WA-8A |
WA-12A |
||
| Wafer |
CAD | CAD | |
| (inch) | φ4, 5, 6, 8 | φ8, 12 | |
| (mm) | 100, 125, 150, 200 | 200, 300 | |
| Size (W×D×H mm) | （mm） | 200×240×215 | 200×290×215 |
| Weight (approx.) | 8Kg | 9Kg | |
| Resolving | Orientation: radial 0.0125mm, angle 0.03° | ||
| Accuracy | Orientation: radial 0.100mm, angle 0.1° | ||
| Correspondence | RS232C | ||
| Designation Angle | 0 ～ 360° | ||
| Process | 8inch Type:Max 6sec., Normal about 5sec., Reset 1 sec. | ||
| Power | AC 100V ・ 50/60Hz ・ 2A | ||
| Vacuum Power | -66.5 kPa ( -500mmHg )or less. | ||
| Center Adjust | ±5mm or less | ||
| Body Cover | Mirror finished. | ||
Dec,2011.
Information
We are ready for design change according to your request.
Please feel free to inquire.
E-mail ：info@texeg.co.jp