| Wafer size (changed using an external signal) | φ 4, 5, 6, 8 (inch) 100, 125, 150, 200 (mm) |
|---|---|
| Outside dimensions (width × depth × height) | W 200 mm × H 240 mm × D 215 mm |
| Body weight | Approx. 8 kg |
| Resolution | Diameter direction 0.0125 mm, angle 0.03° |
| Accuracy | Diameter direction 0.100 mm, angle 0.1° |
| Communication function | RS232C |
| Orientation flat angle specification | 0 to 360° |
| Processing time | 8-inch silicon wafer maximum 6 sec, normal approx. 5 sec, reset 1 sec |
| Power supply | 100VAC • 50/60Hz • 2A |
| Vacuum source | -66.5 kPa (-500 mmHg) or less |
| Wafer center correction | ±5 mm or less |
| Body cover | Polished SUS |