Wafer size (changed using an external signal) |
φ 4, 5, 6, 8 (inch) 100, 125, 150, 200 (mm) |
Outside dimensions (width × depth × height) |
W 200 mm × H 240 mm × D 215 mm |
Body weight |
Approx. 8 kg |
Resolution |
Diameter direction 0.0125 mm, angle 0.03° |
Accuracy |
Diameter direction 0.100 mm, angle 0.1° |
Communication function |
RS232C |
Orientation flat angle specification |
0 to 360° |
Processing time |
8-inch silicon wafer maximum 6 sec, normal approx. 5 sec, reset 1 sec |
Power supply |
100VAC • 50/60Hz • 2A |
Vacuum source |
-66.5 kPa (-500 mmHg) or less |
Wafer center correction |
±5 mm or less |
Body cover |
Polished SUS |